The bond pad redistribution layer (polyimide 1) and the under bump

The bond pad redistribution layer (polyimide 1) and the under bump

Figure 1 from Integrated 122-GHz Antenna on a Flexible Polyimide Substrate With Flip Chip Interconnect

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A review on numerical approach of reflow soldering process for copper pillar technology

Polymers, Free Full-Text

PDF) A positive tone photosensitive polyimide for use on a broadband stepper

Warren FLACK, Vice President, PhD

Electromigration Performance Of Fine-Line Cu Redistribution Layer (RDL) For HDFO Packaging

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Process integration of fine pitch Cu redistribution wiring and SnCu micro-bumping for power efficient LSI devices with high-bandwidth stacked DRAM - ScienceDirect