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The bond pad redistribution layer (polyimide 1) and the under bump
Figure 1 from Integrated 122-GHz Antenna on a Flexible Polyimide Substrate With Flip Chip Interconnect
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A review on numerical approach of reflow soldering process for copper pillar technology
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PDF) A positive tone photosensitive polyimide for use on a broadband stepper
Warren FLACK, Vice President, PhD
Electromigration Performance Of Fine-Line Cu Redistribution Layer (RDL) For HDFO Packaging
WO2018237377A1 - Curable polyimides - Google Patents
Process integration of fine pitch Cu redistribution wiring and SnCu micro-bumping for power efficient LSI devices with high-bandwidth stacked DRAM - ScienceDirect