4.7 (222) In stock
Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
Figure 2 from Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
