4.5 (606) In stock
EASY TO ASSEMBLE-One side is non-sticky which makes it more convenient for production line assemble. MINIMIZATION OF THERMAL RESISTANCE- The thinner
Thermal Pad 2.2 W/mK, 148X148X2.0mm, TG-A2200 Ultra Soft Gap Filler, Heat Sink Cooling Pad, for PC Laptop/GPU/CPU, Good Insulation
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Products - T-Global Technology - Thermal Interface Materials
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EASY TO ASSEMBLE-One side is non-sticky which makes it more convenient for production line assemble. MINIMIZATION OF THERMAL RESISTANCE- The thinner
Thermal Pad 2.2 W/mK, 148X148X2.0mm, TG-A2200 Ultra Soft Gap Filler, Heat Sink Cooling Pad, for PC Laptop/GPU/CPU, Good Insulation
t-Global - PROSTECH
