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Development of a new indium bump fabrication method for large-area
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Figure 2 from Under Bump Metallurgy (UBM)-a technology review for
Flip-Chip Interconnections: Past, Present, and Future
schuler_imaps_ibm
Applied Sciences, Free Full-Text
Micromachines, Free Full-Text
MEMS Technologies Enabling the Future Wafer Test Systems
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PDF) Under bump metallurgy (UBM) - A technology review for flip
PDF) Under bump metallurgy (UBM) - A technology review for flip
Fci Bump Design Guide, PDF, Wafer (Electronics)
PDF) Under Bump Metallurgy (UBM)-a technology review for flip chip
A new failure mechanism of electromigration by surface diffusion
