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Gold Bonding Wire, Au Bond Wire, Ball Bond, Wedge Bond
Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature - ScienceDirect
Figure 6 from Failure Mechanism and Solution Study of IC Wire Bond Heel Crack on Leadframe
Bonding Wire - an overview
Michael MAYER, Associate Professor, Ph.D.
Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature - ScienceDirect
PDF) Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature
John PERSIC Research profile
Thermosonic flip- chip bonding for stud bumps onto copper
PDF) Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature
